Semiconductor die attach system and method
AssigneeInfineon Technologies AG
InventorsJoachim Mahler, Georg Meyer-Berg
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Abstract
A semiconductor package includes a semiconductor die, a substrate for supporting the semiconductor die, an encapsulant covering the semiconductor die and at least part of the substrate, and a die attach material attaching the semiconductor die to the substrate. The die attach material includes molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant. A corresponding method of manufacturing the semiconductor package is also described.
Claims25
A semiconductor package, comprising:
- a semiconductor die;
- a substrate for supporting the semiconductor die;
- an encapsulant covering the semiconductor die and at least part of the substrate;
- and
- a die attach material attaching the semiconductor die to the substrate, the die attach material comprising molecules having a first functional group with at least one free electron pair and a second functional group chemically reacted or reactable with the encapsulant in a way that promotes adhesion with the encapsulant.
Dependencies are inferred from the claim text.