Edge-exposure tool with an ultraviolet (UV) light emitting diode (LED)

A method for edge exposure, the method comprising:

• arranging a wafer within a process chamber, wherein the wafer is covered by a photosensitive layer;
• exposing an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to ultraviolet (UV) radiation generated by a light emitting diode (LED), wherein the UV radiation chemically changes the edge portion of the photosensitive layer, wherein the edge portion of the photosensitive layer extends along an edge of the wafer in a closed path to encircle the center portion of the photosensitive layer, and wherein the LED is in the process chamber and driven by a driver circuit;
• rotating the wafer during the exposing of the edge portion;
• and
• exposing a workpiece-id portion of the photosensitive layer to the UV radiation without exposing the center portion of the photosensitive layer, wherein the workpiece-id portion of the photosensitive layer is surrounded by the center portion of the photosensitive layer, and wherein the wafer is at a same location during the exposing of the edge portion as during the exposing of the workpiece-id portion;
• wherein the exposing of the edge portion comprises:
• generating, and providing an LED controller with, a shutter-open command for a wafer edge exposure (WEE) lamp, wherein the generating and the providing are performed by an exposure controller independent of the LED controller;
• and
• setting the LED to ON in response to the shutter-open command using the driver circuit, wherein the setting is performed by the LED controller and the LED controller is independent of the driver circuit.

A method for edge exposure, the method comprising:

• receiving a workpiece covered by a photosensitive layer;
• exposing an edge portion of the photosensitive layer, but not a center portion of the photosensitive layer, to radiation generated by a light emitting diode (LED), wherein the edge portion of the photosensitive layer extends along an edge of the workpiece in a closed path to enclose the center portion of the photosensitive layer;
• and
• exposing a workpiece-id portion of the photosensitive layer to the radiation without exposing the center portion of the photosensitive layer, wherein the workpiece-id portion of the photosensitive layer is surrounded by the center portion of the photosensitive layer, wherein the workpiece is at a same location during the exposing of the edge portion as during the exposing of the workpiece-id portion, and wherein the exposing comprises alternatingly changing the LED between an ON state and an OFF state.