Resist underlayer film-forming composition for lithography containing polymer having acrylamide structure and acrylic acid ester structure

A resist underlayer film-forming composition comprising:

• a polymer (A) including a unit structure of Formula (1) and a unit structure of Formula (2);
• a crosslinkable compound (B) having at least two groups selected from blocked isocyanate groups, methylol group, or C1-5 alkoxy methyl groups;
• and
• a solvent (C), wherein
• the polymer (A) is a polymer in which the unit structure of Formula (1) and the unit structure of Formula (2) are copolymerized in a mol % ratio of the unit structure of Formula (1):
• the unit structure of Formula (2)=25 to 60:75 to 40
• where
• each of R1 and R4 is a hydrogen atom or methyl group;
• X1 is an NH group;
• X2 is an oxygen atom;
• R2 is an benzene ring;
• R3 is a hydroxy group or a carboxy group;
• and
• Y is a C1-10 alkyl group, which is optionally substituted with a functional group selected from the group consisting of a hydroxy group, a carboxy group, a halogen group, a nitro group, and an amino group.