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AssigneeTokyo Electron Limited
InventorsShinichi Hatakeyama, Masanobu Watanabe, Kouzo Nishi, Seiya Totsuka, Kentaro Yoshihara
Estimating the term…
A substrate processing apparatus according to the present disclosure includes: a nozzle that ejects a processing liquid to a wafer; a force-feeding unit that force-feeds the processing liquid to the nozzle side; a liquid feeding pipeline that includes first and second valves and guides the processing liquid from the force-feeding unit to the nozzle; and a controller. The controller is configured to perform opening the first valve in a state where the second valve is closed and a pressure between the first and second valves is higher than a pressure between the force-feeding unit and the first valve, controlling the force-feeding unit to increase the pressure between the first and second valves that has been decreased by the opening of the first valve, and opening the second valve after the pressure between the first and second valves is decreased by the opening of the first valve.
A substrate processing apparatus comprising:
A substrate processing method using a substrate processing apparatus including a nozzle that ejects a processing liquid to a substrate, a force-feeding unit that force-feeds the processing liquid to the nozzle side, a liquid feeding pipeline that includes first and second valves arranged from the force-feeding unit side toward the nozzle side and guides the processing liquid from the force-feeding unit to the nozzle, and a controller, the substrate processing method comprising:
Dependencies are inferred from the claim text.