US 10,295,749 B1 · Optical interconnect attach to photonic device with partitioning adhesive function

Abstract

A photonic assembly includes an optical die including a suspended membrane structure arranged thereon. A cavity is arranged beneath the suspended membrane structure. An optical interconnect structure is arranged on the optical die. The photonic assembly also includes an optical adhesive arranged on the optical die in contact with the optical interconnect structure. The optical adhesive is arranged beneath the suspended membrane structure to at least partially fill the cavity beneath the suspended membrane structure. The photonic assembly also includes a structural adhesive arranged on the optical die adjacent to the optical adhesive.

Claims15

Dependent claims

A method for attaching an optical interconnect to a photonic device, the method comprising:

disposing a first adhesive on an optical die;
disposing a second adhesive on the optical die adjacent to the first adhesive;
positioning the optical interconnect structure on the first adhesive and the second adhesive to form an assembled structure, the second adhesive arranged beneath a suspended membrane structure optically coupled to the optical interconnect structure on the optical die;
and
curing the assembled structure to at least partially cure the first adhesive.

2 more elements

Dependencies are inferred from the claim text.

Optical interconnect attach to photonic device with partitioning adhesive function

Life of this patent

Optical interconnect attach to photonic device with partitioning adhesive function

Life of this patent

Abstract

Claims15