Integrating silicon photonics and laser dies using flip-chip technology

An optoelectronic device, comprising:

• an optoelectronic die having a surface, wherein a trench having first and second walls and a floor is formed in the surface, and an electrically conductive layer extends from the floor, via the first wall, to the surface;
• a laser die, comprising first and second electrodes and a laser output aperture, wherein the laser die is mounted in the trench and is configured to emit a laser beam, wherein the first electrode is coupled to the electrically conductive layer and wherein the laser output aperture is mechanically aligned with a waveguide that extends from the second wall;
• one or more first electrical interconnects, which are formed on the second electrode of the laser die;
• and
• one or more second electrical interconnects, which are formed on the surface of the optoelectronic die outside the trench and are configured to conduct electrical signals to a substrate,
• wherein a first distance between the surface of the optoelectronic die and the floor of the trench, matches a second distance between the first and second electrodes of the laser die, such that the second electrode is flush with the surface of the optoelectronic die.

A method for producing an optoelectronic device, the method comprising:

• forming, in a surface of a wafer, a trench having first and second walls and a floor, and depositing an electrically conductive layer that extends from the floor, via the first wall, to the surface;
• mounting in the trench a laser die comprising first and second electrodes and a laser output aperture, wherein the first electrode is coupled to the electrically conductive layer and the laser output aperture is mechanically aligned with a waveguide that extends from the second wall;
• forming one or more first electrical interconnects on the second electrode of the laser die;
• forming one or more second electrical interconnects on the surface of the wafer outside the trench;
• and
• coupling the first and second electrical interconnects to a substrate.

An optoelectronic device, comprising:

• an optoelectronic die having a surface, wherein a trench having first and second walls and a floor is formed in the surface, and an electrically conductive layer extends from the floor, via the first wall, to the surface;
• a laser die, comprising first and second electrodes and a laser output aperture, wherein the laser die is mounted in the trench and is configured to emit a laser beam, wherein the first electrode is coupled to the electrically conductive layer and wherein the laser output aperture is mechanically aligned with a waveguide that extends from the second wall;
• one or more first electrical interconnects, which are formed on the second electrode of the laser die;
• and
• one or more second electrical interconnects, which are formed on the surface of the optoelectronic die outside the trench and are configured to conduct electrical signals to a substrate,
• wherein each of the first electrical interconnects and each of the second electrical interconnects has a die-facing surface and a substrate-facing surface, and wherein substrate-facing surfaces of the first electrical interconnects and of the second electrical interconnects are situated on a same plane facing the substrate.