Test socket for semiconductor device and test device including the same
AssigneeSamsung Electronics Co., Ltd.
InventorsMi-so Kim, Jong-won Han
Life of this patent
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Abstract
Provided are a test socket for a semiconductor device and a test device including the test socket. The test device includes a test socket including terminals arranged in a two-dimensional array and corresponding to terminals of the semiconductor device and a ground line extending along at least one row of two-dimensional array; and a substrate electrically connected to the test socket so as to transmit and receive a test signal. The test socket includes a ground line extending along at least one row of the two-dimensional array.
Claims15
A test device for testing a semiconductor device, the test device comprising:
- a test main body for testing the semiconductor device;
- and
- a test control unit for controlling a test performed via the test main body,
- the test main body including a test substrate and a test socket on the test substrate,
- the test socket having a first surface that comes in detachable contact with the semiconductor device to be tested, a second surface opposite the first surface, and a two-dimensional array of terminals that are vertically aligned with and correspond to terminals of the semiconductor device, the test socket including a ground line extending along at least one row of the terminals in the two-dimensional array of the terminals;
- and
- the test substrate being electrically connected to the two-dimensional array of terminals of the test socket so as to transmit and receive a test signal,
- wherein the terminals arranged in the two-dimensional array of the test socket surround a blank region where no terminal is arranged, and the ground line extends along four sides of the blank region.
A test socket, comprising:
- a first surface that comes in detachable contact with a semiconductor device to be tested and a second surface opposite the first surface;
- terminals arranged in a two-dimensional array and corresponding to terminals of the semiconductor device, the terminals including at least one ground terminal;
- and
- a ground line that extends along at least one row of the two-dimensional array, the ground line being electrically connected to the at least one ground terminal,
- wherein the terminals arranged in the two-dimensional array of the test socket surround a blank region where no terminal is arranged, and the ground line extends continuously along four sides of the blank region except for a single gap, such that the ground line is interrupted at the gap.
Dependencies are inferred from the claim text.