Spectrum-inspection device and method for forming the same

A method for manufacturing a spectrum-inspection device, comprising:

• providing a substrate which includes a first photodiode, a second photodiode and a third photodiode;
• forming an interference-type filter over the first photodiode and the second photodiode, wherein the interference-type filter allows a first light beam with wavelength of a multi-band to pass through, and wherein the multi-band comprises a first waveband (a), a second waveband (b), a third waveband (c), and a fourth waveband (d);
• forming a first absorption-type filter over the first photodiode and the second photodiode, wherein the first absorption-type filter allows a second light beam with wavelength of a first region to pass through;
• forming a second absorption-type filter over the second photodiode and the third photodiode, wherein the second absorption-type filter is formed over the first absorption-type filter, and the second absorption-type filter allows a third light beam with wavelength of a second region to pass through, and wherein the second region overlaps the first region;
• and
• forming a third absorption-type filter over the third photodiode, wherein the third absorption-type filter is further formed over the second absorption-type filter, and the third absorption-type filter allows a fourth light beam with wavelength of a third region to pass through, and wherein the third region overlaps at least one of the first region and the second region.