LED array and method for fabricating same

A light emitting diode (LED) array, comprising:

• a submount comprising at least one of a PCB, a FR-4 PCB, or a metal core PCB, said submount further comprising a top surface, a bottom surface, at least six edges, and conductive features;
• said conductive features comprising input and output terminals, a plurality of thermally conductive elements, and a plurality of electrical traces distinct from said input and output terminals, wherein at least some of said conductive features are on a portion of said top surface of said submount;
• said input and output terminals on said top surface, said input terminal proximate to, but set back from, at least first, second, and third edges of said submount, and said output terminal proximate to, but set back from, at least fourth, fifth, and sixth edges of said submount, wherein each of said first, second, and third edges is opposite one of said fourth, fifth, and sixth edges;
• said plurality of thermally conductive elements on said top surface, said plurality of thermally conductive elements comprising a plurality of attach pads;
• and
• a plurality of LEDs, each LED mounted on one of said attach pads on said submount top surface, said attach pads covering more of said submount top surface than said plurality of LEDs, an electrical signal applied to said input and output terminals causing said plurality of LEDs to emit light, at least some of said thermally conductive elements configured to conduct heat from said plurality of LEDs top surface of said submount, wherein said submount is configured to conduct heat from said top surface through said submount;
• wherein said plurality of LEDs are configured such that an electrical path from said input terminal to said output terminal is conveyed via said electrical traces through said plurality of LEDs, said electrical traces being on or above said top surface of said submount;
• and
• a plurality of lenses, each lens in the plurality of lenses over a respective one of said attach pads and covering said at least one of said LEDs attached to said respective one of said attach pads, wherein said plurality of lenses are on said top surface of said wherein said LED array further comprises secondary optics over at least some of said plurality of lenses submount.

A lamp, comprising:

• a lamp body comprising an opening;
• and
• a light source within said body to radiate light through said opening, said light source comprising at least one array, each said array comprising:
• a submount comprising at least one of a PCB, a FR-4 PCB, or a metal core PCB, said submount further comprising a top surface, at least six edges, and conductive features;
• said conductive features comprising input and output terminals, a plurality of conductive elements, and a plurality of electrical traces distinct from said input and output terminals, wherein at least some of said conductive features are on a portion of said top surface of said submount;
• said input and output terminals on a top surface of said submount, said terminals electrically connected to a network, said input terminal along and accessible from at least first, second, and third edges of said submount, and said output terminal along and accessible from at least fourth, fifth, and sixth edges of said submount, wherein each of said first, second, and third edges is opposite one of said fourth, fifth, and sixth edges of said submount;
• said plurality of conductive elements comprising a plurality of attach pads;
• and
• a plurality of LEDs at least one of which is attached to at least one attach pad, said conductive elements configured to transfer heat from said LEDs to said top surface of said submount, wherein said attach pads cover more of said submount than said LEDs, wherein said submount is configured to conduct heat from said top surface through said submount;
• wherein said plurality of conductive elements are configured such that an electrical path from said input terminal to said output terminal travels through said plurality of LEDs via said electrical traces, said electrical traces being on or above said top surface of said submount;
• and
• a plurality of lenses, each lens in the plurality of lenses over a respective one of said attach pads and covering said at least one of said LEDs attached to said respective one of said attach pads, wherein said plurality of lenses are on said top surface of said wherein said lamp further comprises secondary optics over at least some of said plurality of lenses submount.

A method for fabricating an emitter array, comprising:

• forming conductive features on a surface of a submount, said conductive features comprising attach pads and input and output terminals, each of said input and output terminals extending continuously proximate to and along more than one side of said submount, and a plurality of electrical traces narrower than said attach pads and distinct from said input and output terminals;
• providing access to said input and output terminals from more than one side of said submount;
• attaching by mounting a plurality of LEDs to said attach pads such that said plurality of LEDs are electrically connected by said plurality of conductive features through said electrical traces, said plurality of conductive features configured to spread heat from said plurality of LEDs into at least a portion of said submount, wherein said attach pads cover more of said surface of said submount than said LEDs;
• providing a plurality of lenses, each lens in the plurality of lenses over a respective one of said attach pads and covering said at least one of said LEDs attached to said respective one of said attach pads, wherein said plurality of lenses are on said surface of said;
• and mounting secondary optics over said plurality of lenses submount.

A method for fabricating a plurality of arrays, comprising:

• forming sets of attach pads and contact pads and electrical traces on a submount panel sized to accommodate a plurality of arrays, said electrical traces narrower than said attach pads and distinct from said contact pads, with each of said sets corresponding to one array in said plurality of arrays, each of said contact pads extending continuously proximate to, but set back from, more than one side of said submount panel, providing access to said contact pads from more than one side of said submount panel, said traces on or above a top surface of said submount panel;
• attaching by mounting a plurality of LEDs to said submount panel such that an electrical path runs through said LEDs via said electrical traces, said electrical traces being on or above the top surface of said submount, at least one LED of said plurality of LEDs attached to one attach pad of said attach pads, said attach pads covering more of said submount panel than said LEDs and conducting heat from said plurality of LEDs to said submount;
• providing a plurality of lenses, each lens in the plurality of lenses over a respective one of said attach pads and covering said at least one of said LEDs attached to said respective one of said attach pads, wherein said plurality of lenses are on said top surface of said submount panel;
• and
• singulating said submount panel to separate it into a plurality of arrays each of which comprises a plurality of LED electrically connected so that a signal applied to one of said contact pads is conducted to illuminate the LEDs on the particular array.