Wafer treating device and sealing ring for a wafer treating device
AssigneeSuss Microtec Lithography GmbH
InventorsDieter Albert, Michael Braun
Life of this patent
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Abstract
A sealing ring for attaching to a cover ring of a wafer treating device has an annular carrier and a sealing lip which is releasably attached to the carrier.
Claims9
A sealing ring for attaching to a cover ring of a wafer treating device, the sealing ring comprising:
- an annular carrier having a groove and an annular carrier opening;
- a sealing lip releasably attached to said carrier, wherein said sealing lip is fitted into said groove in said carrier;
- and
- wherein said sealing lip extends from said groove, over a part of an upper side of said carrier, and over a conical bearing surface, and into the annular carrier opening until a free end of said sealing lip protrudes beyond a lower side of said carrier.
A wafer treating device having a receptacle for a wafer, having a cover ring placed onto the receptacle, and having a sealing ring with an annular carrier having a groove and an annular carrier opening, a sealing lip releasably attached to said carrier, said sealing ring being adapted for sealing a wafer on said receptacle, and wherein said cover ring is provided with a venting channel which is open to a bearing surface for said sealing ring on said cover ring.
A sealing ring for attaching to a cover ring of a wafer treating device, having an annular carrier having a groove and an annular carrier opening, a sealing lip which is releasably attached to said carrier, wherein a space between a bearing surface of said carrier and said sealing lip is vented to a point on an upper side of said carrier outside said sealing lip by means of a channel.
Dependencies are inferred from the claim text.