Method to integrate multiple electric circuits into organic matrix composite
AssigneeUnited Technologies Corporation
InventorsDavid R. Lyders, Marc E. Holyfiield, Kevin M. Bell
Life of this patent
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Abstract
A method of forming a circuit in a composite component includes providing a plurality of preform modules comprised of an organic matrix composite material, applying at least one electrical circuit on at least first and second preform modules of the plurality of preform modules, and arranging the first and second preform modules such that the electrical circuit of the first preform module is in contact with the electrical circuit of the second preform module. An additional step includes molding the first and second preform modules together to form a one-piece molded component such that the electrical circuits of the first and second preform modules form a complete circuit.
Claims22
A method of forming a circuit in a composite component comprising the steps of:
- (a) providing a plurality of preform modules comprised of an organic matrix composite material;
- (b) applying at least one electrical circuit portion on at least a first preform module and at least one electrical circuit portion on at least a second preform module of the plurality of preform modules;
- (c) arranging the first and second preform modules such that the electrical circuit portion of the first preform module is in contact with the electrical circuit portion of the second preform module;
- and
- (d) molding the first and second preform modules together to form a one-piece molded component such that the electrical circuit portions of the first and second preform modules form a complete circuit.
A method of forming a circuit in a composite component comprising the steps of:
- (a) providing a plurality of preform modules comprised of an organic matrix composite material, wherein the plurality of preform modules are uncured modules;
- (b) applying at least one electrical circuit on at least first and second preform modules of the plurality of preform modules;
- (c) arranging the first and second preform modules such that the electrical circuit of the first preform module is in contact with the electrical circuit of the second preform module;
- and
- (d) molding the first and second preform modules together to form a one-piece molded component such that the electrical circuits of the first and second perform modules form a complete circuit.
A method of forming a circuit in composite component comprising the steps of:
- (a) providing a plurality of preform modules, wherein a multitude of modules includes at least one electrical circuit portion applied to an external surface of the preform modules;
- (b) positioning the plurality of preform modules within a common mold such that the at least one electrical circuit portion of one of the preform modules is in direct contact with at least one electrical circuit portion on an adjacent preform module;
- and
- (c) molding the plurality of preform modules together in the common mold to form a one-piece molded component such that the electrical circuit portions of the plurality of preform modules are permanently connected to form a complete circuit.
A composite component comprising:
- a plurality of preform modules that are attached to each other via a molded interface to form a one-piece molded component, and wherein a multitude of the plurality of preform modules include at least one electrical circuit portion applied to an external surface of an associated preform module, and wherein the electrical circuit portion of one of the preform modules is in direct contact with the electrical circuit portion of an adjacent preform module such that electrical circuit portions on the preform modules are permanently connected together to form a complete circuit within the one-piece molded component.
Dependencies are inferred from the claim text.