Plating method and plating apparatus

A plating method comprising:

• extracting a plating solution containing an additive from a plating bath for plating a substrate;
• immersing a first electrode and a second electrode in the extracted plating solution;
• applying a voltage between the first electrode and the second electrode;
• measuring the voltage applied to the second electrode on which metal is deposited;
• calculating an amount of change in the voltage per predetermined time;
• adjusting a concentration of the additive in the plating solution to keep the amount of change in the voltage within a predetermined control range of the amount of change in the voltage;
• adding the additive to the plating solution to increase the amount of change in the voltage up to the predetermined control range;
• and adding a new plating solution containing no additive to the plating solution to decrease the amount of change in the voltage down to the predetermined control range;
• wherein calculating the amount of change in the voltage comprises
• calculating a first amount of change in the voltage per very short time,
• determining, From the first amount of change in the voltage, a first time at which a voltage value has reached a maximum immediately after the plating is started, determining a second time at which the voltage turns from a downward trend to an upward trend, and
• calculating a second amount of change in the voltage from the voltage value at the first time and the voltage value at the second time.

A plating apparatus comprising:

• a plating bath configured to hold a plating solution containing an additive;
• a substrate holder configured to hold a substrate having a via-hole formed in a surface of the substrate;
• an anode facing the substrate when held by the substrate holder;
• a power source configured to apply a voltage between the substrate and the anode;
• a voltage measuring device configured to measure the voltage applied to the substrate;
• a plating controller configured to control a concentration of the additive in the plating solution based on a measured value of the voltage;
• and a concentration adjuster configured to adjust the concentration of the additive in the plating solution according to a command from the plating controller;
• the plating controller is configured to calculate an amount of change in the voltage per predetermined time, and emit a command to the concentration adjuster to permit the concentration adjuster to adjust the concentration of the additive in the plating solution to keep the amount of change in the voltage within a predetermined control range of the amount of change in the voltage, and
• the concentration adjuster is configured to add the additive to the plating solution to increase the amount of change in the voltage up to the predetermined control range, and add a new plating solution containing no additive to the plating solution to decrease the amount of change in the voltage down to the predetermined control range;
• wherein calculate the amount of change in the voltage comprises
• calculate a first amount of change in the voltage per very short time,
• determine, from the first amount of change in the voltage, a first time at which a voltage value has reached a maximum immediately after a plating is started, determine a second time at which the voltage turns from a downward trend to an upward trend, and
• calculate a second amount of change in the voltage from the voltage value at the first time and the voltage value at the second time.

A plating apparatus comprising:

• a plating bath configured to hold a plating solution containing an additive;
• a substrate holder configured to hold a substrate having a via-hole formed in a surface of the substrate;
• an anode facing the substrate when held by the substrate holder;
• a first power source configured to apply a voltage between the substrate and the anode;
• a plating solution analyzer configured to analyze the plating solution;
• and a concentration adjuster configured to adjust a concentration of the additive in the plating solution;
• the plating solution analyzer includes
• an analyzing bath configured to store the plating solution extracted from the plating bath, a first electrode and a second electrode immersed in the plating solution in the analyzing bath, a second power source configured to apply a voltage between the first electrode and the second electrode, a voltage measuring device configured to measure the voltage applied to the second electrode on which metal is deposited, and a plating controller configured to control the concentration of the additive in the plating solution held in the plating bath based on a measured value of the voltage;
• and
• the plating controller is configured to calculate an amount of change in the voltage per predetermined time, and emit a command to the concentration adjuster to permit the concentration adjuster to adjust the concentration of the additive in the plating solution to keep the amount of change in the voltage within a predetermined control range of the amount of change in the voltage, and
• the concentration adjuster is configured to add the additive to the plating solution to increase the amount of change in the voltage up to the predetermined control range, and add a new plating solution containing no additive to the plating solution to decrease the amount of change in the voltage down to the predetermined control range;
• wherein calculate the amount of change in the voltage comprises
• calculate a first amount of change in the voltage per very short time,
• determine, from the first amount of change in the voltage, a first time at which a voltage value has reached a maximum immediately after a plating is started, determine a second time at which the voltage turns from a downward trend to an upward trend, and
• calculate a second amount of change in the voltage from the voltage value at the first time and the voltage value at the second time.

A plating method comprising:

• disposing an anode and a substrate, having a via-hole formed in a surface thereof, so as to face each other in a plating solution containing an additive;
• applying a voltage between the anode and the substrate for filling the via-hole with metal;
• measuring the voltage applied to the substrate;
• calculating an amount of change in the voltage per predetermined time;
• determining an amount of the additive based on a predetermined relationship between a deviation of the amount of change in the voltage from a predetermined control range and the amount of the additive;
• adding the determined amount of the additive to the plating solution to increase the concentration of the additive in the plating solution;
• and adjusting a concentration of the additive in the plating solution to keep the amount of change in the voltage within the predetermined control range;
• wherein calculating the amount of change in the voltage comprises
• calculating a first amount of change in the voltage per very short time,
• determining, from the first amount of change in the voltage, a first time at which a voltage value has reached a maximum immediately after a plating is started, determining a second time at which the voltage turns from a downward trend to an upward trend, and
• calculating a second amount of char in the voltage from the voltage value at the first time and the voltage value at the second time.

A plating method comprising:

• extracting a plating solution containing an additive from a plating bath for plating a substrate;
• immersing a first electrode and a second electrode in the extracted plating solution;
• applying a voltage between the first electrode and the second electrode;
• measuring the voltage applied to the second electrode on which metal is deposited;
• calculating an amount of change in the voltage per predetermined time;
• determining an amount of the additive based on a predetermined relationship between a deviation of the amount of change in the voltage from a predetermined control range and the amount of the additive;
• adding the determined amount of the additive to the plating solution to increase the concentration of the additive in the plating solution;
• and adjusting a concentration of the additive in the plating solution to keep the amount of change in the voltage within the predetermined control range;
• wherein calculating the amount of change in the voltage comprises
• calculating a first amount of change in the voltage per very short time,
• determining, from the first amount of change in the voltage, a first time at which a voltage value has reached a maximum immediately after the plating is started, determining a second time at which the voltage turns from a downward trend to an upward trend, and
• calculating a second amount of change in the voltage from the voltage value at the first time and the voltage value at the second time.

A plating apparatus comprising:

• a plating bath configured to hold a plating solution containing an additive;
• a substrate holder configured to hold a substrate having a via-hole formed in a surface of the substrate;
• an anode facing the substrate when held by the substrate holder;
• a power source configured to apply a voltage between the substrate and the anode;
• a voltage measuring device configured to measure the voltage applied to the substrate;
• a plating controller configured to control a concentration of the additive in the plating solution based on a measured value of the voltage;
• and a concentration adjuster configured to adjust the concentration of the additive in the plating solution according to a command from the plating controller;
• the plating controller configured to calculate an amount of change in the voltage per predetermined time, determine an amount of the additive based on a predetermined relationship between a deviation of the amount of change in the voltage from a predetermined control range and the amount of the additive, and the concentration adjuster is configured to add the determined amount of the additive to the plating solution to increase the concentration of the additive in the plating solution, and emit a command to the concentration adjuster to permit the concentration adjuster to adjust the concentration of the additive in the plating solution to keep the amount of change in the voltage within the predetermined control range;
• wherein calculate the amount of change in the voltage comprises
• calculate a first amount of change in the voltage per very short time,
• determine, from the first amount of change in the voltage, a first time at which a voltage value has reached a maximum immediately after a plating is started, determine a second time at which the voltage turns from a downward trend to an upward trend, and
• calculate a second amount of change in the voltage from the voltage value at the first time and the voltage value at the second time.

A plating apparatus comprising:

• a plating bath configured to hold a plating solution containing an additive;
• a substrate holder configured to hold a substrate having a via-hole formed in a surface of the substrate;
• an anode facing the substrate when held by the substrate holder;
• a first power source configured to apply a voltage between the substrate and the anode;
• a plating solution analyzer configured to analyze the plating solution;
• and a concentration adjuster configured to adjust a concentration of the additive in the plating solution;
• the plating solution analyzer includes an analyzing bath configured to store the plating solution extracted from the plating bath, a first electrode and a second electrode immersed in the plating solution in the analyzing bath, a second power source configured to apply a voltage between the first electrode and the second electrode, a voltage measuring device configured to measure the voltage applied to the second electrode on which metal is deposited, and a plating controller configured to control the concentration of the additive in the plating solution held in the plating bath based on a measured value of the voltage;
• and the plating controller is configured to calculate an amount of change in the voltage per predetermined time, determine an amount of the additive based on a predetermined relationship between a deviation of the amount of change in the voltage from a predetermined control range and an amount of the additive, and the concentration adjuster is configured to add the determined amount of the additive in the plating solution to increase the concentration of the additive in the plating solution, and emit a command to the concentration adjuster to permit the concentration adjuster to adjust the concentration of the additive in the plating solution to keep the amount of change in the voltage within the predetermined control range;
• wherein calculate the amount of change in the voltage comprises
• calculate a first amount of change in the voltage per very short time,
• determine, from the first amount of change in the voltage, a first time at which a voltage value has reached a maximum immediately after a plating is started, determine a second time at which the voltage turns from a downward trend to an upward trend, and
• calculate a second amount of change in the voltage from the voltage value at the first time and the voltage value at the second time.