Plating apparatus
AssigneeEbara Corporation
InventorTomonori Hirao
Life of this patent
Estimating the term…
Abstract
A plating apparatus includes a processing bath configured to store a processing liquid therein, a transporter configured to immerse a substrate holder, holding a substrate, in the processing liquid, raise the substrate holder out of the processing bath, and transport the substrate holder in a horizontal direction, and a gas flow generator configured to generate a clean gas flow forward of the substrate with respect to a direction in which the substrate holder is transported. The transporter moves the gas flow generator together with the substrate holder in the horizontal direction while transporting the substrate holder in the horizontal direction.
Claims13
A plating apparatus, comprising:
- a processing bath configured to store a processing liquid therein;
- a substrate holder configured to hold a substrate;
- a transporter configured to immerse the substrate holder, holding the substrate, in the processing liquid held in the processing bath, raise the substrate holder out of the processing bath, and transport the substrate holder in a horizontal direction;
- and
- a gas flow generator configured to generate, during the transport of the substrate holder in the horizontal direction by the transporter, a clean gas downward flow forward of the substrate with respect to a direction in which the substrate holder is transported, the gas flow generator having a gas exit facing downward to form the clean gas downward flow,
- the transporter being configured to move the gas flow generator together with the substrate holder in the horizontal direction while transporting the substrate holder in the horizontal direction.
Dependencies are inferred from the claim text.