Levelers for copper deposition in microelectronics

An aqueous electrolytic composition useful in filling submicron features of a semiconductor integrated circuit device or through silicon vias,

• the composition comprising:
• an acid;
• copper ions;
• and
• a leveler that comprises an oligomer and/or polymer compound comprising salts comprising a cation having a structure:
• wherein:
• G is selected from the group consisting of a single covalent bond, —O—, —O-((A)r-O)s— and -((A)r-O)s—
• A has the structure,
• B has the structure,
• D has the structure,
• each of p, r, t, u, w, and y is an integer between 1 and 6 inclusive, each of q, v, x, k, and z is independently an integer between 0 and 6 inclusive, s is an integer between 1 and 10 inclusive, k is at least one when v or x is other than 0, q is at least one when G is other than a single covalent bond, at least one of v or z is at least one when G is a single covalent bond,
• each of R1 to R6, R9 to R19, R23, R25 and R34 is independently selected from the group consisting of hydrogen or lower alkyl comprising 1 to 4 carbon atoms, each of R7, R8, R20, R21, R22, R24 and R33 is independently selected from the group consisting of substituted or unsubstituted aliphatic hydrocarbyl having 1 to 4 carbon atoms, and n is between 1 and 30;
• provided that, when prepared by reaction of an alkylated agent of structure (I)
• with an amine compound of structure (II)
• in which R13 is hydrogen said leveler may comprise or consist of polymer or oligomer chains that correspond to structure (III) except that R13 is displaced in some or all repeat units by reaction with the structure (I) alkylating agent through which said polymer or oligomer-chains are cross-linked.