Stable electroless copper plating compositions and methods for electroless plating copper on substrates
AssigneeRohm and Haas Electronic Materials LLC
InventorsAlejo M. Lifschitz Arribio, Donald E. Cleary
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Abstract
A specific cysteine derivative is added to electroless copper plating compositions to improve the stability of the electroless copper plating compositions such that the plating activity of the electroless plating copper compositions is not compromised even when electroless plating at low plating temperatures and high stabilizer and high leached catalyst concentrations.
Claims9
An electroless copper plating composition comprising one or more sources of copper ions, S-carboxymethyl-L-cysteine, one or more complexing agents, one or more reducing agents, and, optionally, one or more pH adjusting agents, wherein a pH of the electroless copper plating composition is greater than 7.
A method of electroless copper plating comprising:
- e) providing a substrate comprising a dielectric;
- f) applying a catalyst to the substrate comprising the dielectric;
- g) applying an electroless copper plating composition to the substrate comprising the dielectric, wherein the electroless copper plating composition comprises one or more sources of copper ions, S-carboxymethyl-L-cysteine, one or more complexing agents, one or more reducing agents, and, optionally, one or more pH adjusting agents, wherein a pH of the electroless copper plating composition is greater than 7;
- and
- h) electroless plating copper on the substrate comprising the dielectric with the electroless copper plating composition.
Dependencies are inferred from the claim text.