Electroless copper plating polydopamine nanoparticles
AssigneeThe Research Foundation for The State University of New York
InventorsSiyuan Ma, Liang Liu, Vadim Bromberg, Timothy Singler
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AssigneeThe Research Foundation for The State University of New York
InventorsSiyuan Ma, Liang Liu, Vadim Bromberg, Timothy Singler
Estimating the term…
Aqueous dispersions of artificially synthesized, mussel-inspired polyopamine nanoparticles were inkjet printed on flexible polyethylene terephthalate (PET) substrates. Narrow line patterns (4 μm in width) of polydopamine resulted due to evaporatively driven transport (coffee ring effect). The printed patterns were metallized via a site-selective Cu electroless plating process at a controlled temperature (30° C.) for varied bath times. The lowest electrical resistivity value of the plated Cu lines was about 6 times greater than the bulk resistivity of Cu. This process presents an industrially viable way to fabricate Cu conductive fine patterns for flexible electronics at low temperature, and low cost.
A patterned substrate having at least one conductive trace, formed by a process comprising:
A substrate having electrically interconnecting conductive traces, comprising:
A device, comprising:
A printed circuit, comprising:
Dependencies are inferred from the claim text.