Substrate processing apparatus and substrate processing method

A substrate processing apparatus, comprising:

• a container having therein, a processing part in which a substrate is processed, a temperature elevating part in which a temperature of the substrate to be loaded into the processing part is elevated, and a temperature lowering part in which a temperature of the processed substrate unloaded from the processing part is lowered;
• a substrate placing table which is provided to at least one of the temperature elevating part and the temperature lowering part, and which causes heat-transfer to occur with the substrate placed on a placing surface;
• and
• a temperature control part which controls a temperature of the substrate placing table,
• wherein the processing part and at least one of the temperature elevating part and the temperature lowering part are provided at different positions in the container,
• wherein the temperature control part is configured to:
• control the temperature of the substrate placing table so that the temperature of the substrate to be loaded into the processing part is elevated to a predetermined temperature, before the substrate is placed on the substrate placing table, when the substrate placing table is provided to the temperature elevating part;
• and
• control the temperature of the substrate placing table so that the temperature of the processed substrate unloaded from the processing part is lowered to a predetermined temperature, before the substrate is placed on the substrate placing table, when the substrate placing table is provided to the temperature lowering part;
• and
• wherein the processing part has a processing container provided in the container, and a heating part for heating an inside of the processing container, and
• the heating part is controlled so that a temperature in the processing container is maintained at a processing temperature even after a predetermined processing of the substrate is ended.