Substrate processing apparatus
AssigneeTokyo Electron Limited
InventorsKiichi Takahashi, Yuya Sasaki, Kosuke Takahashi
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AssigneeTokyo Electron Limited
InventorsKiichi Takahashi, Yuya Sasaki, Kosuke Takahashi
Estimating the term…
A substrate processing apparatus includes a first hole portion formed through a sidewall of the process chamber and horizontally extending outward and a second hole portion formed to be contiguous with the first hole portion and defining a supply channel for a process gas. The apparatus also includes a gas nozzle, a plurality of seal members and an annular spacer. A proximal end of the gas nozzle is inserted into the first hole portion. The plurality of seal members is spaced apart from each other between an outer circumferential surface of the gas nozzle and the first hole portion. The annular spacer is inserted into the first hole portion and is pressed against an annular surface of an opening periphery of the second hole portion by the gas nozzle in a state where the proximal end of the gas nozzle is engaged with the annular spacer.
A substrate processing apparatus which supplies a process gas to a substrate placed in a hermetic process chamber to perform substrate processing, comprising:
Dependencies are inferred from the claim text.