Target cooling through gun drilled holes
AssigneeApplied Materials, Inc.
InventorsYoshiaki Tanase, Makoto Inagawa, Akihiro Hosokawa
Life of this patent
Estimating the term…
Abstract
A sputter target assembly particularly useful for a large panel plasma sputter reactor having a target assembly sealed both to the main processing chamber and a vacuum pumped chamber housing a moving magnetron. The target assembly to which target tiles are bonded includes an integral plate with parallel cooling holes drilled parallel to the principal faces. The ends of the holes may be sealed and vertically extending slots arranged in two staggered groups on each side and machined down to respective pairs of cooling holes on opposite sides of the backing plate in pairs. Four manifolds tubes are sealed to the four groups of slots and provide counter-flowing coolant paths.
Claims23
A sputtering target, comprising:
- a backing plate formed in a metal plate having two parallel principal surfaces and including a plurality of cooling channels formed in parallel cooling holes which extend laterally parallel to a common axis from a first lateral side surface to an opposed second lateral side surface of the metal plate and which are formed in the metal plate with inner portions that are cylindrically shaped;
- a plurality of inlet and a plurality of outlet holes extending only along respective flow axes from at least one of the principal surfaces to respective pluralities of the cooling holes;
- and
- one or more sputtering target tiles bonded to one of the two principal surfaces in a target area of the backing plate underlain by the inner portions of the cooling holes.
A sputtering target, comprising:
- a backing plate formed in a metal plate having two parallel principal surfaces including one principal surface adapted to be bonded in a target area to one or more sputtering target tiles, the backing plate including a plurality of parallel cooling channels formed in cooling holes formed in the metal plate having at least portions that are cylindrically shaped and underlie the target area and which cooling holes extend laterally parallel to a common axis from a first lateral side surface of the metal plate to a second lateral side surface of the metal plate opposed to the first lateral side surface;
- sealing members extending along respective axes parallel to the common axis and fit in and sealing and plugging the cooling holes adjacent the opposed lateral surfaces;
- and
- inlet and outlet holes each extending only along respective flow axes extending through the one principal surface from at least one of the principal surfaces to respective pluralities of the cooling holes.
A sputtering target backing plate formed by the process comprising:
- drilling a plurality of cylindrical first holes in a metal plate to extend from a first lateral side surface of the metal plate to a second lateral side surface of the metal plate opposed to the first lateral side surface so as to extend parallel to a principal surface of the metal plate, a plurality of cooling channels being formed in inner portions of the first holes away from the first and second lateral side surfaces;
- milling second holes to extend between the principal surface and the inner portions of the respective first holes disposed between plug areas disposed adjacent the first and second lateral side surfaces and arranged on each side of a central area of the metal plate overlying cylindrical portions of the first holes and adapted to be bonded to one or more sputter tiles wherein each of the second holes extends to a respective plurality of the first holes, wherein each of the second holes axially extends only along a respective first axis extending through the principal surface;
- and
- inserting plugs into, filling, and fluid sealing ends of the first holes in the plug areas.
Dependencies are inferred from the claim text.