Copper alloy for electronic and electrical equipment, plastically worked copper alloy material for electronic and electrical equipment, and component and terminal for electronic and electrical equipment

A copper alloy for electronic and electrical devices, comprising:

• Mg in a range of 1.3 mass % to 2.8 mass %;
• and
• a remainder substantially being Cu and inevitable impurities,
• wherein a content of H is set to 10 mass ppm or lower, a content of O is set to 100 mass ppm or lower, a content of S is set to 50 mass ppm or lower, and a content of C is set to 10 mass ppm or lower, and
• wherein, R{220} is 0.9 or lower, where an X-ray diffraction intensity from a {111} plane on a plate surface is represented by I{111}, an X-ray diffraction intensity from a {200} plane on the plate surface is represented by I{200}, an X-ray diffraction intensity from a {220} plane on the plate surface is represented by I{220}, an X-ray diffraction intensity from a {311} plane on the plate surface is represented by I{311}, and a fraction {220} of the X-ray diffraction intensity from the {220} plane on the plate surface is R{220}=I{220}/(I{111}+I{200}+I{220}+I{311}).