Adhesive composition, semiconductor device containing cured product thereof, and method for manufacturing semiconductor device using same
AssigneeToray Industries, Inc.
InventorsKazuyuki Matsumura, Koichi Fujimaru, Daisuke Kanamori
Life of this patent
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Abstract
The purpose of the present invention is to provide an adhesive composition which allows an alignment mark to be recognized, ensures sufficient solder wettability of a joining section, and is excellent in suppression of void generation. The adhesive composition includes: a high-molecular compound (A); an epoxy compound (B) having a weight average molecular weight of 100 or more and 3,000 or less; and a flux (C); and inorganic particles (D) which have on the surfaces thereof an alkoxysilane having a phenyl group and which have an average particle diameter of 30 to 200 nm, the flux (C) containing an acid-modified rosin.
Claims6
An adhesive composition comprising:
- a high-molecular compound (A) which is a combination of a phenoxy resin and a polyimide resin having a weight average molecular weight of 10,000 or more and 100,000 or less;
- an epoxy compound (B) having a weight average molecular weight of 100 or more and 3,000 or less;
- a flux (C) containing an acid-modified rosin;
- inorganic particles (D) which have on the surfaces thereof an alkoxysilane having a phenyl group and which have an average particle diameter of 30 to 200 nm;
- and particles of a curing accelerator (E) having an average particle diameter of 0.1 μm or more, wherein the adhesive composition has an alignment mark recognition value which is 7 or more.
Dependencies are inferred from the claim text.