Method for manufacturing hybrid packaging material
AssigneeKorea Electrotechnology Research Institute
InventorsDong-jun Kang, Hoy-yul Park, Myeong-sang Ahn
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AssigneeKorea Electrotechnology Research Institute
InventorsDong-jun Kang, Hoy-yul Park, Myeong-sang Ahn
Estimating the term…
Disclosed herein is a method of manufacturing a hybrid packaging material, comprising the steps of: (a) forming a colloidal inorganic nanosol; (b) surface-treating the inorganic nanosol of step (a) with an organic metal alkoxide containing an organic function group by stirring the inorganic nanosol together with the organic metal alkoxide; (c) replacing a solvent of the inorganic nanosol with an organic solvent different in type from the solvent to prepare an organic solvent-type inorganic nanosol; (d) substituting the organic solvent of the inorganic nanosol of step (c) with a functional organic monomer or a silicon compound, followed by concentration to prepare a solvent-free organic-inorganic hybrid material; and (e) adding a nanoclay dispersed in a solvent to the solvent-free organic-inorganic hybrid material.
A method of manufacturing a hybrid packaging material, comprising the steps of:
Dependencies are inferred from the claim text.