Thermosetting resin composition for semiconductor package and prepreg using the same

A thermosetting resin composition for a semiconductor package, wherein the thermosetting resin composition comprises:

• 5 to 20 parts by weight of an acrylic rubber and 160 to 350 parts by weight of a filler, based on 100 parts by weight of a binder including an epoxy resin, a bismaleimide resin, a cyanate resin and a benzoxazine resin,
• wherein the acrylic rubber has a weight average molecular weight of 30×104 to 65×104, a viscosity of 1,000 to 6,000 mPa·s, and a glass transition temperature of 10° C. to 50° C., and
• wherein the filler is at least one mixture including a first inorganic filler having an average particle diameter of 0.2 μm to 1 μm in which a (meth)acrylate silane compound is bonded to the surface of the first inorganic filler, and a second inorganic filler having an average particle diameter of 20 nm to 50 nm in which a (meth)acrylate silane compound is bonded to the surface of the second inorganic filler.