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US 10,294,324 B2Granted
Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device
AssigneeNamics Corporation
InventorsTakashi Yamaguchi, Shinichi Abe
Life of this patent
Estimating the term…
Abstract
There is provided a resin composition which has long-term heat resistance, rapid curing properties, high adhesive strength during heating, a low change ratio of adhesive strength, and a low normal temperature elastic modulus. The resin composition includes (A) a compound having in its molecule an OH group and any one of primary to tertiary amines, (B) dicyandiamide and/or imidazoles, (C) bismaleimides, and (D) a compound having in its molecule one or more epoxy groups, or cyanate ester.
Claims13
A resin composition comprising:
- (A) a compound having in its molecule an OH group and any one of primary to tertiary amines;
- (B) dicyandiamide and/or imidazoles;
- (C) dimer acid-modified bismaleimides;
- and
- (D) a compound having in its molecule one or more epoxy groups, or cyanate ester.
2 more elements
Dependencies are inferred from the claim text.