Process for manufacturing a packaged device, in particular a packaged micro-electro-mechanical sensor, having an accessible structure, such as a mems microphone and packaged device obtained thereby
AssigneeSTMicroelectronics S.r.l.
InventorFederico Giovanni Ziglioli
Life of this patent
Estimating the term…
Abstract
In order to manufacture a packaged device, a die having a sensitive region is bonded to a support, and a packaging mass of moldable material is molded on the support so as to surround the die. During molding of the packaging mass, a chamber is formed, which faces the sensitive region and is connected to the outside environment. To this end, a sacrificial mass of material that may evaporate/sublimate is dispensed on the sensitive region; the packaging mass is molded on the sacrificial mass; a through hole is formed in the packaging mass to extend as far as the sacrificial mass; the sacrificial mass is evaporated/sublimated through the hole.
Claims18
A process for manufacturing a packaged device, the process comprising:
- bonding a first die to a support, the first die having a first surface and a sensitive region formed at the first surface;
- forming a sacrificial mass of material on the sensitive region of the first die;
- in a molding process, providing a molding material on the support and around the first die to form a molded packaging mass;
- and
- forming a chamber between a surface of the molded packaging mass and the sensitive region by evaporating/sublimating the sacrificial mass through a hole in the packaging mass, the chamber being delimited by a surface of the molding material and the first surface of the first die, the surface of the molding material facing the first surface of the first die, the chamber being in fluid communication with an environment outside of the molded packaged device.
A process comprising:
- forming a sacrificial layer over a semiconductor die;
- forming a barrier layer on the sacrificial layer;
- in a molding process, providing a moldable material around barrier layer, the sacrificial layer, and the semiconductor die to form a molded packaging mass;
- and
- removing the sacrificial layer to form a cavity that exposes an active surface of the semiconductor die, wherein the cavity is delimited by a surface of the barrier layer and a surface of the semiconductor die.
A process comprising:
- coupling a semiconductor die to a substrate;
- coupling a first end of a conductive wire to the semiconductor die and a second end of the conductive wire to the substrate;
- forming a sacrificial layer on at least a portion of the semiconductor die and around the conductive wire;
- in a molding process, providing moldable material around the sacrificial layer and the semiconductor die to form a molded packaging mass;
- forming an opening in the molded packaging mass to expose the sacrificial layer;
- and
- removing the sacrificial layer through the opening to form a cavity that exposes an active surface of the semiconductor die and the conductive wire.
Dependencies are inferred from the claim text.