Methods and apparatus for high temperature thermocouple installation
AssigneeThe United States of America as represented by the Secretary of the Air Force
InventorsWilliam E Boles, James R Taylor, Christopher T Allen
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Abstract
A method for bonding and encapsulating a sensor to a substrate by using a mold having a top surface, a bottom surface, a void, and a channel includes disposing the flexible mold in contact with a surface of the substrate. The method further includes passing the sensor through the channel and terminating the sensor within the void at an offset distance from the substrate. The method further includes filling the void and encapsulating the sensor with a substantially fixed volume and substantially fixed geometry of cement.
Claims11
A method for bonding and encapsulating a sensor to a substrate by using a mold having a top surface, a bottom surface, a void, and a channel, the method comprising:
- disposing the flexible mold in contact with a surface of the substrate;
- passing the sensor through the channel and terminating the sensor within the void at an offset distance from the substrate;
- and
- filling the void and encapsulating the sensor with a substantially fixed volume and a substantially fixed geometry of cement.
The method of claim one, wherein the fixed volume of cement is accomplished by screeding overfilled cement off of the top of the flexible mold prior to curing the cement.
Dependencies are inferred from the claim text.