Cutting method of liquid crystal panel

A cutting method of a liquid crystal panel, which is employed to cut a substrate having an upper substrate and a lower substrate to form the liquid crystal panel, wherein the cutting method comprises:

• providing a control device, an image identification device and a knife having a first knife and a second knife, and the substrate has respective cutting positions of the knife in a first cutting direction, and the control device is preset with cutting position information of the respective cutting positions;
• setting a reference alignment mark on the substrate, and the reference alignment mark is positioned between two adjacent cutting positions, wherein the reference alignment mark comprises a first reference alignment mark and a second reference alignment mark, and the first reference alignment mark is positioned on the upper substrate and the second reference alignment mark is positioned on the lower substrate, wherein a projection position of the first reference alignment mark on the lower substrate coincides with the second reference alignment mark;
• capturing the first reference alignment mark and the second reference alignment mark with the image identification device only in one time, and generating reference position information indicating the reference alignment mark;
• controlling the first knife to cut the upper substrate and the second knife to cut the lower substrate to move to the respective cutting positions in sequence and to cut with the control device according to the reference position information and the cutting position information by only capturing the first reference alignment mark and the second reference alignment mark in the one time.