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US 10,293,463 B2Granted
Chemical mechanical planarization pad conditioner with elongated cutting edges
AssigneeEntegris, Inc.
InventorsAndrew Galpin, Daniel Wells
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AssigneeEntegris, Inc.
InventorsAndrew Galpin, Daniel Wells
Estimating the term…
A CMP pad conditioner for conditioning a polishing pad. Various embodiments of the disclosure include a plurality of elongated protrusions which work a conditioned surface of a polishing pad at a variety of attack angles as the CMP pad conditioner engages the polishing pad. Because of the elongated geometry of the protrusions, the variety of attack angles will tend to flex the conditioned face of the polishing pad in a multifaceted manner. Such multifaceted manipulation of the conditioned face enhances the cut rate of the conditioner assembly and the removal of debris in the pores of the polishing pad that are residual from the CMP process, to better open the pores of the polishing pad and to better maintain the removal rate in the CMP process.
A chemical mechanical planarization (CMP) conditioning segment, comprising:
A chemical mechanical planarization (CMP) pad conditioner, comprising:
A chemical mechanical planarization (CMP) pad conditioner, comprising a substrate including a front surface and defining a plurality of elongated protrusions unitary therewith protruding from a substrate floor of said front surface, each elongated protrusion of said plurality of elongated protrusions defining an elongate axis, said plurality of elongated protrusions protruding in a frontal direction that is substantially normal to said front surface and defining an average height measured from said substrate floor, said plurality of elongated protrusions defining a plurality of linear clusters that are in columns, each linear cluster comprises a plurality of said elongated protrusions that are in the same angular orientation, said column comprising a mix of linear clusters that have a variety of sweep angles.
Dependencies are inferred from the claim text.