Polishing apparatus
AssigneeEbara Corporation
InventorsOsamu Nabeya, Tetsuji Togawa, Makoto Fukushima, Hozumi Yasuda
Life of this patent
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Abstract
A polishing apparatus has a polishing pad, a top ring for holding a semiconductor wafer, and a vertical movement mechanism operable to move the top ring in a vertical direction. The polishing apparatus also has a distance measuring sensor operable to detect a position of the top ring when a lower surface of the top ring is brought into contact with the polishing pad, and a controller operable to calculate an optimal position of the top ring to polish the semiconductor wafer based on the position detected by the distance measuring sensor. The vertical movement mechanism includes a ball screw mechanism operable to move the top ring to the optimal position.
Claims18
An apparatus for polishing a substrate by pressing the substrate against a polishing surface, the apparatus comprising:
- a top ring configured to press the substrate,
- a retainer ring arranged at peripheral portion of the top ring, and configured to be brought into contact with the polishing surface when polishing the substrate,
- a stage on which the substrate to be received or delivered is placed,
- a mechanism configured to move the stage toward the top ring for receiving or delivering the substrate, and
- a measuring unit configured to measure a position of the stage,
- wherein, when the substrate is received or delivered, the upper surface of the stage is brought into contact with the lower surface of the retainer ring,
- wherein the position of the stage is measured in a state such that the upper surface of the stage is brought into contact with the lower surface of the retainer ring, and
- wherein an amount of wear of the retainer ring is calculated by comparing the position of the stage measured with a reference value.
A method performed by an apparatus for polishing a substrate, the apparatus comprising:
- a top ring configured to press the substrate, a retainer ring arranged at peripheral portion of the top ring, and configured to be brought into contact with the polishing surface when polishing the substrate, and a stage on which the substrate to be received or delivered is placed, wherein
- the method comprises:
- moving the stage toward the top ring for receiving or delivering the substrate to bring the upper surface of the stage into contact with the lower surface of the retainer ring,
- measuring a position of the stage in a state such that the upper surface of the stage is brought into contact with the lower surface of the retainer ring, and
- calculating an amount of wear of the retainer ring by comparing the position of the stage measured with a reference value.
An apparatus for polishing a substrate by pressing the substrate against a polishing surface, the apparatus comprising:
- a top ring configured to press the substrate,
- a retainer ring arranged at peripheral portion of the top ring, and configured to be brought into contact with the polishing surface when polishing the substrate,
- a stage on which the substrate to be received or delivered is placed,
- a mechanism configured to move the stage toward the top ring for receiving or delivering the substrate, and
- a measuring unit configured to measure a distance moved of the stage,
- wherein, when the substrate is received or delivered, the upper surface of the stage is brought into contact with the lower surface of the retainer ring,
- wherein the distance moved of the stage is measured until the upper surface of the stage is brought into contact with the lower surface of the retainer ring, and
- wherein an amount of wear of the retainer ring is calculated from the distance moved of the stage measured by referring data stored in the apparatus, the data representing interrelationship between the distance moved of the stage and the amount of wear of the retainer ring.
A method performed by an apparatus for polishing a substrate, the apparatus comprising:
- a top ring configured to press the substrate, a retainer ring arranged at peripheral portion of the top ring, and configured to be brought into contact with the polishing surface when polishing the substrate, and a stage on which the substrate to be received or delivered is placed, wherein
- the method comprises:
- moving the stage toward the top ring for receiving or delivering the substrate to bring the upper surface of the stage into contact with the lower surface of the retainer ring,
- measuring the distance moved of the stage until the upper surface of the stage is brought into contact with the lower surface of the retainer ring, and
- calculating an amount of wear of the retainer ring from the distance moved of the stage measured by referring data stored in the apparatus, the data representing interrelationship between the distance moved of the stage and the amount of wear of the retainer ring.
Dependencies are inferred from the claim text.