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US 10,293,454 B2Granted
Polishing head, polishing apparatus and polishing method
AssigneeToshiba Memory Corporation
InventorsTakayuki Nakayama, Takashi Watanabe
Life of this patent
Estimating the term…
Abstract
In one embodiment, a polishing head includes an elastic film configured to form pressure rooms to which a pressure fluid is fed, and configured to press a substrate onto a polishing surface with a fluid pressure of the pressure fluid. The head further includes a first magnetic generator provided above a partition wall that separates the pressure rooms. The head further includes a second magnetic generator configured to form at least a portion of the partition wall or provided below the partition wall.
Claims14
A polishing head comprising:
- an elastic film configured to form pressure rooms to which a pressure fluid is fed, and configured to press a substrate onto a polishing surface by deforming the elastic film with a pressure of the pressure fluid, the pressure rooms being adjacent to each other in a first direction and expanding or contracting in a second direction that is perpendicular to the first direction due to the deformation of the elastic film;
- a first magnetic generator provided above two of the pressure rooms and a partition wall that separates the two of the pressure rooms and outside the pressure rooms;
- and
- a second magnetic generator configured to form at least a portion of the partition wall or provided below the partition wall,
- wherein the first magnetic generator is an electromagnet configured to adjust a direction and an intensity of magnetic force that acts between the first magnetic generator and the second magnetic generator,
- the second magnetic generator is a permanent magnet,
- a pressure that presses the substrate includes a first pressure depending on the pressure of the pressure fluid fed to the pressure rooms and a second pressure depending on the magnetic force, a magnitude of the first pressure being larger than a magnitude of the second pressure, and
- the elastic film comprises first portions that are positioned under the pressure rooms and a second portion that is positioned in a vicinity of the partition wall between the first portions, the first pressure mainly deforms the first portions out of the first and second portions, and the second pressure mainly acts to apply pressure to the second portion out of the first and second portions.
5 more elements
A polishing apparatus comprising:
- a polishing table configured to retain a polishing pad;
- and
- a polishing head configured to retain a substrate to press the substrate onto a polishing surface of the polishing pad,
- the polishing head comprising:
- an elastic film configured to form pressure rooms to which a pressure fluid is fed, and configured to press the substrate onto the polishing surface by deforming the elastic film with a pressure of the pressure fluid, the pressure rooms being adjacent with each other in a first direction and expanding or contracting in a second direction that is perpendicular to the first direction due to the deformation of the elastic film;
- a first magnetic generator provided above two of the pressure rooms and a partition wall that separates the two of the pressure rooms and outside the pressure rooms;
- and
- a second magnetic generator configured to form at least a portion of the partition wall or provided below the partition wall,
- wherein the first magnetic generator is an electromagnet configured to adjust a direction and an intensity of magnetic force that acts between the first magnetic generator and the second magnetic generator,
- the second magnetic generator is a permanent magnet,
- a pressure that presses the substrate includes a first pressure depending on the pressure of the pressure fluid fed to the pressure rooms and a second pressure depending on the magnetic force, a magnitude of the first pressure being larger than a magnitude of the second pressure, and
- the elastic film comprises first portions that are positioned under the pressure rooms and a second portion that is positioned in a vicinity of the partition wall between the first portions, the first pressure mainly deforms the first portions out of the first and second portions, and the second pressure mainly acts to apply pressure to the second portion out of the first and second portions.
9 more elements
Dependencies are inferred from the claim text.