Pre-treating polymer tubing or hose with a hydrophobic coating to reduce depletion of corrosion inhibitor

A cooling apparatus for transferring heat from at least one electronic component mounted on a circuit board, comprising:

• a plurality of liquid-coolant cooling system components in fluid communication with each other, wherein the plurality of liquid-coolant cooling system components comprise a first liquid-cooled cold plate and one or more other liquid-coolant cooling system components selected from a group consisting of an additional liquid-cooled cold plate, a coolant supply header, a coolant return header, a coolant supply manifold, a coolant return manifold, a coolant pump, a coolant reservoir, a modular cooling unit (MCU), and combinations thereof, wherein each liquid-cooled cold plate is positioned over and in thermal contact with at least one electronic component mounted on a circuit board and has a thermal dissipation channel extending through a portion thereof;
• a liquid coolant;
• a corrosion inhibitor dissolved in the liquid coolant;
• at least one hose interconnecting at least two of the plurality of liquid-coolant cooling system components, wherein the at least one hose comprises polymer tubing containing oxide surfaces, wherein the hose is pre-treated with a fluoropolymer hydrophobic coating having a coating thickness suitable to reduce depletion of the corrosion inhibitor dissolved in the liquid coolant, and wherein the fluoropolymer hydrophobic coating is formed by binding together fluoropolymers and by binding the fluoropolymers to the oxide surfaces contained in the polymer tubing;
• wherein the fluoropolymer hydrophobic coating is formed from one or more fluoroethylene/vinyl ether (FEVE) copolymers.