Ultrasonic probe and manufacturing method thereof

An ultrasonic probe comprising:

• a capacitive micromachined ultrasonic transducer (cMUT) array configured to generate ultrasonic waves;
• an integrated circuit comprising:
• a first surface bonded to the cMUT array,
• pads configured to be interfaced with the cMUT array and aligned in a row on the first surface,
• an anisotropic conductive film (ACF) provided on the pads, and
• a second surface disposed opposite to the first surface;
• a support part provided on the second surface of the integrated circuit, to support the integrated circuit;
• a control board which is configured to control the integrated circuit and comprises:
• an edge portion which is disposed underneath a lower surface of the support part and extends along the row of the pads, and
• a side surface which is connected to the edge portion and is perpendicular to the lower surface of the support part, wherein the side surface of the control hoard is extended in a direction away from the support part in an alignment with an edge of the lower surface of the support part, so that the control board is provided within a footprint of the lower surface of the support part;
• and
• a flexible printed circuit board comprising:
• a first end placed on the pads and electrically connected to the pads through the ACF, to output signals to the integrated circuit,
• a body extending from the ACF along a portion of the side surface of the control board, and
• a second end connected to a connector disposed on the side surface,
• wherein the cMUT array comprises a plurality of tiles bonded to the integrated circuit and spaced apart from each other and the pads.