Tunable radio frequency systems using piezoelectric package-integrated switching devices

A package substrate comprising:

• a plurality of organic dielectric layers and a plurality of conductive layers to form the package substrate of a reconfigurable radio frequency (RF) system for transmitting and receiving communications with different frequency bands;
• a cavity formed in at least one organic dielectric layer of the plurality of organic dielectric layers of the package substrate;
• and
• a piezoelectric switching device integrated within the cavity of the package substrate, the piezoelectric switching device having a piezoelectric material that is coupled to first and second electrodes and a movable structure having a released end that is directly coupled to one of the first and second electrodes by an insulating film, wherein the insulating film is in contact with the released end of the moveable structure, and the insulating film is in contact with the one of the first and second electrodes, the released end positioned within the cavity and being capable of switching from a first position to a second position based on actuation of the piezoelectric switching device to tune a tunable component of the reconfigurable RF system.

A computing device comprising:

• at least one processor to process data;
• and
• a reconfigurable communication module coupled to the at least one processor, the reconfigurable communication module includes a transceiver die and a package substrate coupled to the transceiver die, the package substrate includes a plurality of organic dielectric layers, a plurality of conductive layers, a cavity formed in at least one organic dielectric layer of the plurality of organic dielectric layers of the package substrate, and a piezoelectric switching device integrated within the cavity of the package substrate, the piezoelectric switching device having a piezoelectric material that is coupled to first and second electrodes and a movable structure that is mechanically coupled to one of the electrodes, the movable structure having a released end positioned within the cavity of the package substrate and being capable of switching from a first position to a second position based on actuation of the piezoelectric switching device to tune a tunable component of the reconfigurable communication module, wherein the piezoelectric material is coupled to first and second electrodes and a movable structure having a released end that is directly coupled to one of the first and second electrodes by an insulating film, wherein the insulating film is in contact with the released end of the moveable structure, and the insulating film is in contact with the one of the first and second electrodes, the released end positioned within the cavity and being capable of switching from a first position to a second position based on actuation of the piezoelectric switching device to tune a tunable component of the reconfigurable RF system.

A reconfigurable RF filter formed in a package substrate comprising:

• a plurality of organic dielectric layers and a plurality of conductive layers to form the package substrate having the reconfigurable RF filter;
• a cavity formed in at least one organic dielectric layer of the plurality of organic dielectric layers of the package substrate;
• and
• a piezoelectric switching device integrated within the cavity of the package substrate, the piezoelectric switching device having a piezoelectric material that is coupled to first and second electrodes and a movable structure having a released end that is directly coupled to one of the first and second electrodes by an insulating film, wherein the insulating film is in contact with the released end of the moveable structure, and the insulating film is in contact with the one of the first and second electrodes, the released end positioned within the cavity and being capable of switching from a first position to a second position based on actuation of the piezoelectric switching device to tune a tunable component of the reconfigurable RF filter.