Sliding member
AssigneeDaido Metal Company Ltd.
InventorKazuaki Toda
Life of this patent
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Abstract
Provided is a sliding material including a substrate; and a copper alloy layer bonded to the substrate. The copper alloy includes 2.0 to 15.0% by mass of tin. The copper alloy layer includes a sliding body part including a sliding surface, and a gradient region including a bond surface with the substrate. A tin concentration in the gradient region reduces from the sliding body part toward the bond surface. A method for producing the siding material is also provided. The method includes preparing the substrate having a first surface and a second surface opposite to the first surface; melting the copper alloy; casting the molten copper alloy on the first surface of the substrate; and solidifying the copper alloy unidirectionally by cooling the substrate from the second surface by a coolant.
Claims13
A sliding material comprising:
- a substrate;
- and
- a copper alloy layer bonded to the substrate, the copper alloy comprising 2.0 to 15.0% by mass of tin,
- wherein the copper alloy layer comprises
- a gradient region including a bond surface with the substrate, and
- a sliding body part including a surface opposite to the bond surface,
- wherein a tin concentration in the gradient region reduces from the sliding body part toward the bond surface, and
- wherein a ratio of tin concentration in the gradient region is 0.1 to 0.8 by mass percentage.
Dependencies are inferred from the claim text.