Power module assembly with dual substrates and reduced inductance
AssigneeGM Global Technology Operations LLC
InventorsTerence G. Ward, Constantin C. Stancu, Marko Jaksic
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AssigneeGM Global Technology Operations LLC
InventorsTerence G. Ward, Constantin C. Stancu, Marko Jaksic
Estimating the term…
A power module assembly has a first substrate including a first layer, second layer and a third layer. The first layer is configured to carry a switch current flowing in a first direction. A second substrate is operatively connected to the first substrate and includes a fourth layer, fifth layer and a sixth layer. A conductive joining layer connects the third layer of the first substrate and the fourth layer of the second substrate. The conductive joining layer may be a first sintered layer. The third layer of the first substrate, the first sintered layer and the fourth layer of the second substrate are configured to function together as a unitary conducting layer carrying the switch current in a second direction substantially opposite to the first direction. The net inductance is reduced by a cancellation effect of the switch current going in opposite directions.
A power module assembly comprising:
Dependencies are inferred from the claim text.