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US 10,283,298 B2Granted
Chip fuse
AssigneeSOC Corporation
InventorsToshitaka Ogawa, Hiroo Arikawa
Life of this patent
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Abstract
A method for manufacturing a chip fuse, comprises: a liquid film forming step for forming a liquid film of dispersion liquid having metal nanoparticles dispersed therein on a principal surface of a substrate; a fuse film forming step for forming a fuse film on the principal surface by irradiating the liquid film with laser light; and a first terminal forming step for forming first terminals that each connects to the fuse film on each of both end sides in a longitudinal direction of the fuse film on the principal surface.
Claims10
A chip fuse comprising:
- a substrate;
- a fuse film, being provided on a principal surface of the substrate;
- an one-end-side internal terminal group, being provided at one end side of the fuse film on the principal surface and including a plurality of first internal terminals that are connected to the fuse film while separated from each other in a longitudinal direction;
- and
- an other-end-side internal terminal group, being provided at the other end side of the fuse film on the principal surface and including a plurality of second internal terminals that are connected to the fuse film while separated from each other in the longitudinal direction.
2 more elements
Dependencies are inferred from the claim text.