Sample holder, device and method for detaching of a first substrate

A method for detaching a pair of substrates from each other, said method comprising:

• providing a first substrate and a second substrate that is temporarily bonded to the first substrate by an interconnect layer to form a substrate stack, said interconnect layer having a first side connected to the first substrate and a second side connected to the second substrate, wherein the interconnect layer is comprised of a plurality of layers including at least one adhesive layer and at least one separation layer;
• holding the first substrate to a holding area of a first wafer chuck, said first wafer chuck including a cooling body having a cooling area and a fixing means to fix the first substrate to the holding area;
• activating the fixing means to fix the first substrate to the holding area of the first wafer chuck;
• cooling the interconnect layer to a temperature that is at or below a critical temperature for embrittlement of the at least one separation layer, thereby forming cracks in the at least one separation layer, said critical temperature being at or below 0° C., wherein the cooling of the interconnect layer includes flowing of a cooling fluid through the cooling area of the cooling body of the first wafer chuck and wherein the cooling of the interconnect layer forms cracks through only a portion of the at least one separation layer in a partial embrittlement;
• and
• detaching the first substrate from the second substrate.