Microphone system and method for manufacturing the same
AssigneesHyundai Motor Company, Kia Motors Corporation
InventorIlseon Yoo
Life of this patent
Estimating the term…
Abstract
A microphone system may include a measuring device that includes a plurality of sound elements and a semiconductor chip connected to the sound elements and receives a vibration signal and a noise signal from the outside to cancel the vibration signal and changes a phase of the noise signal to output a reverse phase noise signal; and a driver that is connected to the semiconductor chip and is included in a front glass of a vehicle and vibrates in response to the reverse phase noise signal to cancel a noise signal inputted from the outside.
Claims11
A microphone system, comprising:
- a measuring device that includes a plurality of sound elements and a semiconductor chip connected to the sound elements and receives a vibration signal and a noise signal from an outside thereof to cancel the vibration signal and changes a phase of the noise signal to output a reverse phase noise signal;
- and
- a driver that is connected to the semiconductor chip and is included in a front glass of a vehicle and vibrates in response to the reverse phase noise signal to cancel a noise signal inputted from an outside thereof,
- wherein the driver comprises:
- a piezoelectric film;
- electrode layers that are bonded to a first surface and a second surface of the piezoelectric film and are electrically connected to the semiconductor chip;
- and
- flexible layers that are bonded to external surfaces of the electrode layers and are bonded internal surfaces of an internal front glass and an external front glass.
A method for manufacturing a microphone system, the method comprising:
- forming a measuring device including a first sound element, a second sound element, and a semiconductor chip in a case including a sound inlet;
- and
- forming a driver that is connected to the semiconductor chip and is included in a front glass of a vehicle,
- wherein the forming the driver comprises:
- forming a first electrode layer on a first surface of a first copper foil;
- coating a first flexible layer on an upper portion of the first electrode layer;
- etching the first copper foil;
- forming a second electrode layer on a first surface of a second copper foil;
- coating a piezoelectric film on a first surface of the second electrode layer;
- bonding the piezoelectric film to the first electrode layer;
- etching the second copper foil;
- and
- coating a second flexible layer on a second surface of the second electrode layer.
Dependencies are inferred from the claim text.