Optical integrated circuit systems, devices, and methods of fabrication

A method of fabricating an optical integrated circuit device, the method comprising:

• providing an electrically insulating substrate;
• forming a first waveguide over the electrically insulating substrate, wherein the first waveguide is configured to transmit an optical signal;
• forming a first electrostatic discharge (ESD) protection structure over the electrically insulating substrate, the first ESD protection structure being in direct contact with and electrically coupled to the first waveguide, wherein the first ESD protection structure is both electrically non-insulating and substantially optically transparent to the optical signal;
• forming an ESD diode at the electrically insulating substrate, wherein a cathode of the ESD diode is electrically coupled to the first ESD protection structure;
• and
• forming a ground connection at the electrically insulating substrate, the ground connection being electrically coupled to an anode of the ESD diode.

A system comprising:

• an electrically insulating substrate;
• an optical integrated circuit (OIC) disposed over the electrically insulating substrate;
• a plurality of waveguides disposed over the electrically insulating substrate and optically coupled to the OIC, the plurality of waveguides being configured to transmit a plurality of optical signals, wherein the plurality of waveguides comprises a first waveguide and a second waveguide;
• an external circuit optically coupled to the plurality of waveguides;
• a first seal ring disposed around a perimeter of the OIC, wherein
• the first seal ring comprises a first portion in direct contact with and electrically coupled to each of the plurality of waveguides,
• the first portion is both electrically non-insulating and substantially optically transparent to the plurality of optical signals, and
• the first seal ring comprises a second portion, the first portion and the second portion forming a closed loop;
• an ESD diode comprising an anode and a cathode, the cathode being electrically coupled to the first seal ring;
• and
• a ground connection electrically coupled to the anode of the ESD diode.