Substrate-free interconnected electronic mechanical structural systems

A substrate-free, interconnected electronic mechanical structural system, comprising:

• a first substrate-free, electronic subsystem comprising a plurality of sequential planar layers of a material disposed parallel to a first plane, the layers including an electronic component and a first mechanical alignment feature;
• and
• a second substrate-free, electronic subsystem comprising a plurality of sequential planar layers of a material disposed parallel to a second plane, the layers including an electronic component and a second mechanical alignment feature, wherein the first and second mechanical alignment features are configured to cooperate to join the first and second subsystems such that the first and second planes of the respective subsystems are orthogonal to one another.