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US 10,257,944 B2Granted
Board edge connector
AssigneeMicron Technology, Inc.
InventorKurt B. Smith
Life of this patent
Estimating the term…
Abstract
Apparatuses and methods for forming serial advanced technology attachment (SATA) board edge connectors with electroplated hard gold contacts. One example method can include forming a tie bar on an inner layer of a printed circuit board (PCB), forming a trace on an outer layer of the PCB, forming a via, wherein the via electrically couples the tie bar to the trace, forming a contact coupled to the trace on the outer layer, and sending an electrical charge from the tie bar through the via and the trace to the contact to electroplate the contact.
Claims8
A method comprising:
- forming a tie bar on an inner layer of a printed circuit board (PCB);
- forming a trace on an outer layer of the PCB
- forming a via, wherein the via electrically couples the tie bar to the trace;
- forming a contact coupled to the trace on the outer layer;
- and
- sending an electrical charge from the tie bar through the via and the trace to the contact to electroplate the contact.
3 more elements
A method comprising:
- forming a tie bar on an inner layer of a printed circuit board (PCB);
- forming a trace on an outer layer of the PCB;
- forming a via, wherein the via electrically couples the tie bar to the trace;
- forming a contact coupled to the trace on the outer layer;
- sending an electrical charge from the tie bar through the via and the trace to the contact to electroplate the contact;
- and
- removing the via.
4 more elements
Dependencies are inferred from the claim text.