Electronic device with integrated circuit chip provided with an external electrical connection network

An electronic device assembly, comprising:

• a first electronic device, comprising:
• a substrate having a first major surface and a second major surface opposite the first major surface;
• an electrically conductive trace extending across at least a portion of the first major surface of the substrate, the electrically conductive trace comprising a first end and a second end opposite the first end;
• an integrated circuit (IC) chip electrically coupled to the first end of the electrically conductive trace by a first external electrically conductive element disposed between the IC chip and the first end of the electrically conductive trace, wherein the first end of the electrically conductive trace is located within a masking area of the IC chip, and wherein the second end of the electrically conductive trace is located outside the masking area of the IC chip;
• and
• an impedance-compensating inductor located outside the masking area of the IC chip, the impedance-compensating inductor being disposed in a passageway extending through a thickness of the substrate, the impedance-compensating inductor comprising a wire coil that is coiled around a base element disposed in the passageway, the wire coil having a first end electrically coupled to the second end of the electrically conductive trace, the wire coil further having a second end electrically coupled to a back contact located at the second major surface of the substrate;
• and
• a second electronic device electrically coupled to the back contact by a second external electrically conductive element located between the second electronic device and the back contact.

An electronic device, comprising:

• a substrate having a first external surface and a second external surface opposite the first external surface;
• an electrically conductive trace extending across at least a portion of the first external surface of the substrate, the electrically conductive trace comprising a first end and a second end opposite the first end;
• an integrated circuit (IC) chip electrically coupled to the first end of the electrically conductive trace by a first external electrically conductive element disposed between the IC chip and the first end of the electrically conductive trace, wherein the first end of the electrically conductive trace is located within a masking area of the IC chip, and wherein the second end of the electrically conductive trace is located outside the masking area of the IC chip;
• an electrically conductive via extending through a thickness of the substrate, the electrically conductive via having a first end physically contacting an undersurface of the first end of the electrically conductive trace;
• and
• a second external electrically conductive element located outside the substrate and at the second external surface of the substrate, the second external electrically conductive element being electrically coupled to a second end of the electrically conductive via opposite the first end of the electrically conductive via, the second external electrically conductive element comprising:
• an impedance-compensating inductor located outside the masking area of the IC chip, the impedance-compensating inductor comprising a wire coil that is coiled around a base element.