Conformal coating materials
AssigneeInternational Business Machines Corporation
InventorsSarah K. Czaplewski, Joseph Kuczynski, Jason T. Wertz, Jing Zhang
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Abstract
In an example, a process for reversibly bonding a conformal coating to a dry film solder mask (DFSM) material is disclosed. The process includes applying a first conformal coating material to a DFSM material. The first conformal coating material includes a first functional group, and the DFSM material includes a second functional group that is different from the first functional group. The process also includes reversibly bonding the first conformal coating material to the DFSM material via a chemical reaction of the first functional group and the second functional group.
Claims15
A printed circuit board comprising:
- a printed circuit board (PCB) substrate;
- a dry film solder mask (DFSM) material overlying a first portion of the PCB substrate;
- and
- a conformal coating material chemically and reversibly bonded to the DFSM material via a cyclic compound, wherein the conformal coating material is derived from a compound comprising a dienophile functional group.
A printed circuit board comprising:
- a printed circuit board (PCB) substrate;
- a dry film solder mask (DFSM) material overlying a first portion of the PCB substrate, wherein the DFSM material is derived from a compound comprising a dienophile functional group;
- and
- a conformal coating material reversibly bonded to the DFSM material via a cyclic compound.
Dependencies are inferred from the claim text.