US 10,257,939 B2 · Method of fabricating tamper-respondent sensor

Abstract

Methods of fabricating tamper-respondent electronic circuit structures and electronic assembly packages are provided which include, at least in part, a tamper-respondent sensor including one or more formed flexible layers of, for instance, a dielectric material, having opposite first and second sides, and circuit lines defining at least one resistive network. The circuit lines are disposed on at least one of the first side or the second side of the formed flexible layer(s). The formed flexible layer(s) with the circuit lines includes curvatures, and the circuit lines overlie, at least in part, the curvatures of the formed flexible layer(s). In certain embodiments, the formed flexible layer(s) may be one or more corrugated layers or one or more flattened, folded layers.

Claims10

Dependent claims

A method of fabricating a tamper-respondent sensor, the method comprising:

forming at least one formed flexible layer having opposite first and second sides with surface curvatures extending from the opposite first and second sides of the at least one formed flexible layer;
providing circuit lines comprising at least one resistive network on at least one of the first side or the second side of the at least one formed flexible layer, the circuit lines wrapping over, at least in part, the surface curvatures extending from the at least one first side or second side of the at least one formed flexible layer;
and
wherein forming the at least one formed flexible layer comprises collapsing by flattening the at least one formed flexible layer with the circuit lines into at least one flattened, folded layer by applying a z-direction force and a shear force to the at least one formed flexible layer.

1 more element

Dependencies are inferred from the claim text.

Method of fabricating tamper-respondent sensor

Life of this patent

Method of fabricating tamper-respondent sensor

Life of this patent

Abstract

Claims10