Device for electrically coupling a plurality of semiconductor device layers by a common conductive layer

An assembly, comprising:

• a first laminate electronic component comprising a first dielectric layer, at least one first semiconductor die embedded in the first dielectric layer and at least one first contact pad comprising a first conductive via, and
• a second laminate electronic component comprising a second dielectric layer, at least one second semiconductor die embedded in the second dielectric layer and at least one second contact pad comprising a second conductive via,
• wherein the first conductive via is electrically coupled to the second conductive via by a common conductive layer,
• wherein the first laminate electronic component further comprises a third contact pad and a fourth contact pad positioned on an upper side of the first laminate electronic component, and wherein the second laminate electronic component is arranged on the upper side of the first laminate electronic component and is disposed between the third contact pad and the fourth contact pad,
• wherein the first conductive via extends through the first contact pad, and
• wherein the second conductive via extends through the second contact pad, and
• wherein the common conductive layer extends from the first contact pad to the second contact pad,
• wherein a lower side of the first laminate electronic component that is opposite from the upper side comprises a plurality of contact pads, the contact pads being configured to electrically couple the assembly to a printed circuit board.