Chip resistor, method of producing chip resisitor and chip resistor packaging structure

A chip resistor comprising:

• a first electrode;
• a second electrode spaced apart from the first electrode in a first direction;
• and
• a resistor portion bonded to the first electrode and the second electrode;
• wherein the first electrode includes a front surface and a reverse surface which face away from each other,
• the resistor portion extends along a plane spreading in the first direction and a second direction crossing the first direction,
• the first electrode includes a first electrode side surface facing to a first side in the second direction and a second electrode side surface facing to a second side in the second direction,
• the first electrode side surface includes a first electrode linear trace formed surface formed with a linear trace, and a first electrode breakage trace formed surface connected to the first electrode linear trace formed surface and formed with a breakage trace, and
• the first electrode linear trace formed surface is closer to the front surface than the first electrode breakage trace formed surface is.