Systems and methods for providing grooved vias in high-speed printed circuit boards

An Information Handling System (IHS), comprising:

• a printed circuit board (PCB) having a plurality of layers;
• and
• an integrated circuit (IC) coupled to the PCB, the PCB comprising:
• a first trace formed in a first layer of the PCB;
• a second trace formed in a second layer of the PCB;
• and
• a via coupling the first trace to the second trace, the via comprising:
• a first portion between the first trace and the second trace, wherein the first portion has an internal surface created with a first drill bit having a first pitch;
• a second portion between the second trace and a bottom surface of the PCB, wherein the second portion has a length that causes a signal transmitted through the first portion to resonate within the second portion, wherein the second portion has a grooved internal surface created with a second drill bit having a second pitch smaller than the first pitch, wherein the second pitch is approximately 0.5 mils, and wherein the grooved internal surface reduces the resonance;
• and
• a third portion between the first trace and a top surface of the PCB.

A printed circuit board (PCB), comprising:

• a first layer having a first trace;
• a second layer having a second trace;
• and
• a via coupling the first trace to the second trace, the via comprising:
• a first portion between the first trace and the second trace, wherein the first portion has an internal surface having a first pitch;
• a second portion between the second trace and a bottom surface of the PCB, wherein the second portion has a length that causes a signal transmitted through the first portion to resonate within the second portion, wherein the second portion has an internal grooved surface having a second pitch smaller than the first pitch, wherein the second pitch is approximately 0.5 mils, and wherein the internal grooved surface reduces the resonance;
• and
• a third portion between the first trace and a top surface of the PCB.