Method for manufacturing an electronic assembly

A method for manufacturing an electronic assembly, the method comprising:

• obtaining a first substrate film for accommodating electronics;
• printing a first electrical contact pad on the first substrate film;
• coupling an electrically spring connector to the first electrical contact pad;
• and
• molding, in a cavity defined by a mold structure, a second material layer onto the first substrate film to embed the electrically conductive spring connector, wherein the electrically conductive spring connector extends through the cavity during molding to be in contact with an element on an opposite side of the cavity with respect to the first electrical contact pad such that at least a part of the electrically conductive spring connector is accessible after molding to provide an electrical connection to the first electrical contact pad through the second material layer.

A method for manufacturing an electronic assembly, the method comprising:

• obtaining first and second substrate films for accommodating electronics;
• printing a first electrical contact pad on the first substrate film;
• printing a second electrical contact pad on the second substrate film to a corresponding position with respect to the first electrical contact pad;
• coupling an electrically conductive member to the first electrical contact pad;
• molding, in a cavity defined by a mold structure, a second material layer between the first substrate film and the second substrate film to embed the electrically conductive member, wherein, during molding, the electrically conductive member extends from the first electrical contact pad through the cavity to be in contact with the second electrical contact pad such that at least a part of the electrically conductive member is accessible after molding to provide an electrical connection to the first electrical contact pad through the second material layer, the electrically conductive member being compressed against the second electrical contact pad to provide an electrical connection from the first electrical contact pad to the second electrical contact pad through the second material layer;
• and
• thermoforming or cold forming at least one of the first or second substrate films to a desired three-dimensional shape, wherein at least one of the first or second substrate films is a flexible substrate film.