Tamper-proof electronic packages formed with stressed glass

A tamper-proof electronic package comprising:

• a circuit board;
• a glass enclosure mounted to the circuit board, and enclosing, at least in part, at least one electronic component within a secure volume, the glass enclosure being a multi-sided glass enclosure comprising stressed glass with a compressively-stressed surface layer, the multi-sided glass enclosure including a first glass enclosure side and a second glass enclosure side, the second glass enclosure side extending away from the first glass enclosure side, and the first glass enclosure side and the second glass enclosure side each defining a respective side of the secure volume;
• a tamper-respondent detector monitoring, at least in part, the stressed glass to facilitate defining the secure volume, the stressed glass fragmenting with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detecting the fragmenting of the stressed glass, the tamper-respondent detector monitoring structural integrity of the stressed glass via a sensor on an inner surface of the stressed glass within the secure volume, the sensor fragmenting with fragmentation of the stressed glass to facilitate detection of the attempted intrusion event and erasure of confidential information stored within the secure volume;
• and
• an embedded tamper-respondent sensor within the circuit board, the embedded tamper-respondent sensor further facilitating defining, at least in part, the secure volume.

A fabrication method comprising:

• fabricating a tamper-proof electronic package, the fabricating comprising:
• providing a glass enclosure enclosing, at least in part, at least one electronic component within a secure volume, the glass enclosure being a multi-sided glass enclosure comprising stressed glass with a compressively-stressed surface layer, the multi-sided glass enclosure including a first glass enclosure side and a second glass enclosure side, the second glass enclosure side extending away from the first glass enclosure side, and the first glass enclosure side and the second glass enclosure side each defining a respective side of the secure volume;
• and
• providing a tamper-respondent detector monitoring, at least in part, the stressed glass to facilitate defining the secure volume, the stressed glass fragmenting with an attempted intrusion event through the stressed glass, and the tamper-respondent detector detecting the fragmenting of the stressed glass, the tamper-respondent detector monitoring structural integrity of the stressed glass via a sensor an inner surface of the stressed glass within the secure volume, the sensor fragmenting with fragmentation of the stressed glass to facilitate detection of the attempted intrusion event and erasure of confidential information stored within the secure volume.