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US 10,257,887 B2Granted
Substrate support assembly
AssigneeApplied Materials, Inc.
InventorsAlexander Matyushkin, Dan Katz, John Holland, Theodoros Panagopoulos, Michael D. Willwerth
Life of this patent
Estimating the term…
Abstract
A substrate support assembly comprises a ceramic puck comprising a substrate receiving surface, and having embedded therein: (i) an electrode to generate an electrostatic force to retain a substrate placed on the substrate receiving surface; and (ii) a heater to heat the substrate, the heater comprising a plurality of spaced apart heater coils. A compliant layer bonds the ceramic puck to a base, the compliant layer comprising a silicon material. The base comprises a channel to circulate fluid therethrough, the channel having a channel inlet and a channel terminus.
Claims20
A substrate support assembly comprising:
- (a) a ceramic puck comprising:
- (i) a substrate receiving surface;
- (ii) an electrode to generate an electrostatic force to retain a substrate placed on the substrate receiving surface;
- (iii) a plurality of spaced apart resistive heating elements;
- and
- (iv) a backside surface having a plurality of shaped mesas that are spaced apart from one another to contact a base, the shaped mesas comprising posts, cones, rectangular blocks, or cylindrical mounds, and wherein the shaped mesas include an array of first mesas that are adjacent to a channel inlet which is adjacent to a periphery of the base, and an array of second mesas that are adjacent to a channel terminus, and comprising at least one of:
- (1) the first mesas are spaced apart a first distance that is larger than a second distance between the second mesas;
- and
- (2) the first mesas have a first contact region that is smaller than a second contact region of the second mesas;
- (b) a compliant polymer layer bonding the ceramic puck to the base, the compliant polymer layer comprising silicon;
- and
- (c) the base comprising a channel to circulate fluid therethrough, the channel having the channel inlet and the channel terminus.
9 more elements
A substrate support assembly comprising:
- (a) a ceramic puck comprising:
- (i) a substrate receiving surface;
- (ii) an electrode to generate an electrostatic force to retain a substrate placed on the substrate receiving surface;
- (iii) a plurality of spaced apart resistive heating elements;
- and
- (iv) a backside surface having a plurality of shaped mesas that are spaced apart from one another and that contact a base, the shaped mesas comprising posts, cones, rectangular blocks, or cylindrical mounds, and wherein the shaped mesas include an array of first mesas that are adjacent to a channel inlet which is adjacent to a periphery of the base, and an array of second mesas that are adjacent to a channel terminus, and comprising at least one of:
- (1) the first mesas are spaced apart a first distance that is larger than a second distance between the second mesas;
- and
- (2) the first mesas have a first contact region that is smaller than a second contact region of the second mesas;
- (b) a compliant layer bonding the ceramic puck to the base, the compliant layer comprising a silicon material;
- and
- (c) the base comprising a channel to circulate fluid therethrough, the channel having the channel inlet and the channel terminus.
9 more elements
A substrate support assembly comprising:
- (a) a ceramic puck comprising a substrate receiving surface, the ceramic puck having embedded therein (i) an electrode to generate an electrostatic force to retain a substrate placed on the substrate receiving surface;
- and (ii) a plurality of spaced apart resistive heating elements;
- (b) a compliant layer bonding the ceramic puck to a base, the compliant layer comprising a silicon material;
- (c) the base comprising a channel to circulate fluid therethrough, the channel having a channel inlet and a channel terminus;
- and
- (d) a controller configured to:
- (i) independently apply different electrical power levels to the resistive heating elements;
- (ii) control the temperature and flow rate of fluid passed through the channel of the base;
- (iii) receive temperature signals from a temperature sensor;
- and
- (iv) serve as a feedback control loop to adjust the power applied to the resistive heating elements and the flow of fluid through the channel of the base in response to the temperature signals from the temperature sensor, and wherein the controller is programmed to (i) increase a fluid temperature in the base to a higher level prior to ramping up the electrical power levels applied to the resistive heating elements in the ceramic puck, or (ii) decrease a fluid temperature in the base to a lower level prior to ramping down the electrical power levels applied to the resistive heating elements in the ceramic puck.
8 more elements
A substrate support assembly comprising:
- (a) a ceramic puck comprising a substrate receiving surface, an electrode to generate an electrostatic force to retain a substrate placed on the substrate receiving surface, and a plurality of spaced apart resistive heating elements;
- (b) a compliant polymer layer bonding the ceramic puck to a base, the compliant polymer layer comprising silicon;
- (c) the base comprising a channel to circulate fluid therethrough, the channel having a channel inlet and a channel terminus;
- and
- (d) a controller configured to:
- (i) independently apply different electrical power levels to the resistive heating elements;
- (ii) control the temperature and flow rate of fluid passed through the channel of the base;
- (iii) receive temperature signals from a temperature sensor;
- and
- (iv) serve as a feedback control loop to adjust the power applied to the resistive heating elements and the flow of fluid through the channel of the base in response to the temperature signals from the temperature sensor, and wherein the controller is programmed to (i) increase a fluid temperature in the base to a higher level prior to ramping up the electrical power levels applied to the resistive heating elements in the ceramic puck, or (ii) decrease a fluid temperature in the base to a lower level prior to ramping down the electrical power levels applied to the resistive heating elements in the ceramic puck.
7 more elements
Dependencies are inferred from the claim text.